Tin-copper solder commodity
Tin-copper solder denotes commercially supplied soldering material described as Sn-Cu, rather than elemental tin or copper, a mineral species, or a documented waste stream. Jadhav and colleagues studied material supplied by Taiwan-Solid Enterprises Limited; their methods do not establish a prior service life or recovery from discarded equipment. They report nominal Sn-Cu composition as 63-37%, which is retained as reported rather than corrected to a conventional alloy formulation. Their surface observations suggest a tin-rich coating and a copper-containing interior, so this record does not assert homogeneous bulk alloy composition. Evidence applies to those experimental pieces, not every product sold under the Sn-Cu solder description. No constituent criticality designation is inherited.
Microbial & Biochemical Mechanisms (1)
Laboratory copper and tin leaching with an Acetobacter culture preparation
The study reports dissolution of copper and tin when Sn-Cu solder pieces were exposed to a preparation from an acid-producing Acetobacter culture. The observed endpoint is dissolved metal measured by ICP-OES, not an isolated recovered product. Acid-mediated leaching is the authors' interpretation; the experiment does not isolate a causal contribution from newly produced acetic acid or establish that living cells were required during leaching. It is a laboratory observation, not industrial deployment or a demonstrated treatment of end-of-life solder.
Commercial pieces were cut to 3 mm, rinsed with water and 75% ethanol, and dried. The microbial arm used 100 mg Sn-Cu solder with 4 mL of culture preparation at 30 degrees C and 150 rpm for 30 h. Methods describe culture grown for 24 h at 30 degrees C and 150 rpm in yeast-glucose-ethanol-acetic-acid medium; results instead call the leaching preparation a collected culture supernatant, without specifying a cell-removal procedure. Biomass presence and viability during leaching therefore remain unresolved. The paper names Acetobacter sp. TISTR 102 but attributes supply to BCRC in Taiwan without a BCRC accession. No species or strain CURIE is assigned to that unauthenticated experimental culture. Experiments were performed in three sets; the error-bar statistic and independence of those sets are not defined. An uninoculated-medium control and a matched acid-only control for this microbial preparation are not reported.
jadhav2017
jadhav2017
tistr102
Sources & References
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jadhav2017: Jadhav U, Su C, Chakankar M, Hocheng H (2017). Acetic acid mediated leaching of metals from lead-free solders. Bioresources and Bioprocessing 4:42. DOI 10.1186/s40643-017-0173-5. Complete ten-page original: materials and culture methods on pp. 2-3; microbial leaching result on pp. 6-7 and Figure 7; separate chemical-acid SEM/EDS experiment on pp. 7-8 and Figure 8.
https://doi.org/10.1186/s40643-017-0173-5 (accessed 2026-10-16) -
tistr102: Thailand Institute of Scientific and Technological Research, Culture Collection. Bacterial catalogue entry TISTR 102: Acetobacter pasteurianus, originally deposited as Acetobacter aceti; original number No. 24 DMKU B-45. Catalogue identity does not independently authenticate the culture used in Jadhav et al.
https://www.tistr.or.th/tistr_culture/cdetail.php?tno=102&type=b (accessed 2026-10-16)
Curation History
| Timestamp | Curator | Action | Summary |
|---|---|---|---|
2026-10-16T08:06:49Z |
codex (GPT-6; codex) | CREATE | Created a commercial solder product record with bounded culture-associated leaching evidence and explicit feed, strain, biomass, control and outcome uncertainty. |
Record source: data/records/tin-copper-solder.yaml